PIC16C57-LPI/JW123
vs
PIC16C57-LPE/S123
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
DIP-28
|
DIE
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Date Of Intro |
2017-12-19
|
2017-12-19
|
| Has ADC |
NO
|
NO
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| Boundary Scan |
NO
|
NO
|
| CPU Family |
PIC
|
PIC
|
| Clock Frequency-Max |
40 MHz
|
0.032 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-CDIP-T28
|
X-XUUC-N
|
| Length |
37.08 mm
|
|
| Number of DMA Channels |
|
|
| Number of I/O Lines |
20
|
20
|
| Number of Terminals |
28
|
|
| Number of Timers |
1
|
1
|
| On Chip Program ROM Width |
12
|
12
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
NO
|
NO
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
UNSPECIFIED
|
| Package Code |
WDIP
|
DIE
|
| Package Shape |
RECTANGULAR
|
UNSPECIFIED
|
| Package Style |
IN-LINE, WINDOW
|
UNCASED CHIP
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| ROM (words) |
2048
|
2048
|
| ROM Programmability |
UVPROM
|
EPROM
|
| Seated Height-Max |
5.72 mm
|
|
| Speed |
40 MHz
|
40 MHz
|
| Supply Voltage-Max |
6.25 V
|
6 V
|
| Supply Voltage-Min |
5 V
|
2.5 V
|
| Supply Voltage-Nom |
5 V
|
3.25 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
UPPER
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
15.24 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare PIC16C57-LPI/JW123 with alternatives
Compare PIC16C57-LPE/S123 with alternatives