PIC16C56-XTE/JW vs PIC16C56-XTE/S feature comparison

PIC16C56-XTE/JW Microchip Technology Inc

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PIC16C56-XTE/S Microchip Technology Inc

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Part Life Cycle Code Active Not Recommended
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Package Description DIP-18 DIE,
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Address Bus Width
Bit Size 8 8
Boundary Scan NO
CPU Family PIC PIC
Clock Frequency-Max 40 MHz 4 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code R-CDIP-T18 R-XUUC-N18
Length 22.86 mm
Number of DMA Channels
Number of I/O Lines 12 12
Number of Terminals 18 18
Number of Timers 1 1
On Chip Program ROM Width 12 12
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels NO NO
Package Body Material CERAMIC, METAL-SEALED COFIRED UNSPECIFIED
Package Code WDIP DIE
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE, WINDOW UNCASED CHIP
ROM (words) 1024 1024
ROM Programmability UVPROM OTPROM
Seated Height-Max 4.95 mm
Speed 40 MHz 4 MHz
Supply Voltage-Max 6 V 6 V
Supply Voltage-Min 3.25 V 3 V
Supply Voltage-Nom 5 V 3.25 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm
Terminal Position DUAL UPPER
Width 7.62 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code DIE
Pin Count 18
JESD-609 Code e3
Qualification Status Not Qualified
RAM (bytes) 25
Supply Current-Max 3.3 mA
Terminal Finish MATTE TIN

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