PIC16C56-LPE/SP
vs
PIC16C56-LPESP
feature comparison
| Part Life Cycle Code |
Not Recommended
|
Not Recommended
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
,
|
DIP,
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Date Of Intro |
2017-12-19
|
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
18
|
| Has ADC |
|
NO
|
| Address Bus Width |
|
|
| Bit Size |
|
8
|
| CPU Family |
|
PIC
|
| Clock Frequency-Max |
|
0.032 MHz
|
| DAC Channels |
|
NO
|
| DMA Channels |
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
|
R-PDIP-T18
|
| JESD-609 Code |
|
e3
|
| Length |
|
22.987 mm
|
| Number of DMA Channels |
|
|
| Number of I/O Lines |
|
12
|
| Number of Terminals |
|
18
|
| Number of Timers |
|
1
|
| On Chip Program ROM Width |
|
12
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| PWM Channels |
|
NO
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
DIP
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
IN-LINE
|
| Qualification Status |
|
Not Qualified
|
| RAM (bytes) |
|
25
|
| ROM (words) |
|
1024
|
| ROM Programmability |
|
OTPROM
|
| Speed |
|
0.04 MHz
|
| Supply Voltage-Max |
|
6.25 V
|
| Supply Voltage-Min |
|
2.5 V
|
| Supply Voltage-Nom |
|
3.25 V
|
| Surface Mount |
|
NO
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
AUTOMOTIVE
|
| Terminal Finish |
|
MATTE TIN
|
| Terminal Form |
|
THROUGH-HOLE
|
| Terminal Pitch |
|
2.54 mm
|
| Terminal Position |
|
DUAL
|
| Width |
|
7.62 mm
|
|
|
|
Compare PIC16C56-LPE/SP with alternatives
Compare PIC16C56-LPESP with alternatives