PIC16C56-HSEP vs PIC16C56-HSE/SP feature comparison

PIC16C56-HSEP Microchip Technology Inc

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PIC16C56-HSE/SP Microchip Technology Inc

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Not Recommended Not Recommended
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Part Package Code DIP
Package Description DIP, DIP18,.3 ,
Pin Count 18
Reach Compliance Code compliant compliant
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO
Address Bus Width
Bit Size 8
Boundary Scan NO
CPU Family PIC
Clock Frequency-Max 16 MHz
DAC Channels NO
DMA Channels NO
External Data Bus Width
JESD-30 Code R-PDIP-T18
JESD-609 Code e3
Length 22.8 mm
Number of DMA Channels
Number of I/O Lines 12
Number of Terminals 18
Number of Timers 1
On Chip Data RAM Width 8
On Chip Program ROM Width 12
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
PWM Channels NO
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP18,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Qualification Status Not Qualified
RAM (bytes) 25
RAM (words) 25
ROM (words) 1024
ROM Programmability OTPROM
Seated Height-Max 4.32 mm
Speed 40 MHz
Supply Current-Max 20 mA
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
Supply Voltage-Nom 5 V
Surface Mount NO
Technology CMOS
Temperature Grade AUTOMOTIVE
Terminal Finish MATTE TIN
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 7.62 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 1 1
Date Of Intro 2017-12-19
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare PIC16C56-HSEP with alternatives

Compare PIC16C56-HSE/SP with alternatives