PIC16C56-HSE/JW
vs
PIC16C56-HSS/SO
feature comparison
| Part Life Cycle Code |
Not Recommended
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
DIP, DIP18,.3
|
0.300 INCH, PLASTIC, SOIC-18
|
| Pin Count |
18
|
18
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
NO
|
NO
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| Boundary Scan |
NO
|
NO
|
| CPU Family |
PIC
|
PIC
|
| Clock Frequency-Max |
4 MHz
|
20 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-XDIP-T18
|
R-PDSO-G18
|
| Length |
22.987 mm
|
11.53 mm
|
| Number of DMA Channels |
|
|
| Number of I/O Lines |
12
|
12
|
| Number of Terminals |
18
|
18
|
| Number of Timers |
1
|
1
|
| On Chip Program ROM Width |
8
|
12
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
NO
|
NO
|
| Package Body Material |
CERAMIC
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP18,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
25
|
25
|
| ROM (words) |
1024
|
1024
|
| ROM Programmability |
UVPROM
|
OTPROM
|
| Speed |
2.5 MHz
|
20 MHz
|
| Supply Current-Max |
10 mA
|
20 mA
|
| Supply Voltage-Max |
6.25 V
|
5.5 V
|
| Supply Voltage-Min |
2.5 V
|
5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Additional Feature |
|
ROM PROTECT
|
| Format |
|
FIXED POINT
|
| Integrated Cache |
|
NO
|
| JESD-609 Code |
|
e3
|
| Low Power Mode |
|
YES
|
| Moisture Sensitivity Level |
|
1
|
| Number of External Interrupts |
|
|
| Number of Serial I/Os |
|
|
| On Chip Data RAM Width |
|
8
|
| RAM (words) |
|
25
|
| Terminal Finish |
|
Matte Tin (Sn)
|
|
|
|
Compare PIC16C56-HSE/JW with alternatives
Compare PIC16C56-HSS/SO with alternatives