PIC16C554T-04SS
vs
PIC16C554T-04ISS
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
SSOP
|
SSOP
|
| Package Description |
SSOP,
|
0.209 INCH, PLASTIC, SSOP-20
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
compliant
|
compliant
|
| Has ADC |
NO
|
NO
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| Clock Frequency-Max |
4 MHz
|
4 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G20
|
| JESD-609 Code |
e3
|
e3
|
| Length |
7.2 mm
|
7.2 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of I/O Lines |
13
|
13
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| PWM Channels |
NO
|
NO
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SSOP
|
SSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| ROM Programmability |
OTPROM
|
OTPROM
|
| Seated Height-Max |
2 mm
|
2 mm
|
| Speed |
4 MHz
|
4 MHz
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
5.3 mm
|
5.3 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
3
|
3
|
|
|
|
Compare PIC16C554T-04SS with alternatives
Compare PIC16C554T-04ISS with alternatives