PIC16C554T-04I/SS301
vs
PIC16C554/JW
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
DIP
|
| Package Description |
|
0.300 INCH, WINDOWED, CERDIP-18
|
| Pin Count |
|
18
|
| Samacsys Manufacturer |
|
Microchip
|
| Has ADC |
|
NO
|
| Address Bus Width |
|
|
| Bit Size |
|
8
|
| CPU Family |
|
PIC
|
| Clock Frequency-Max |
|
20 MHz
|
| DAC Channels |
|
NO
|
| DMA Channels |
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
|
R-GDIP-T18
|
| JESD-609 Code |
|
e3
|
| Length |
|
22.86 mm
|
| Number of I/O Lines |
|
13
|
| Number of Terminals |
|
18
|
| On Chip Program ROM Width |
|
14
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| PWM Channels |
|
NO
|
| Package Body Material |
|
CERAMIC, GLASS-SEALED
|
| Package Code |
|
WDIP
|
| Package Equivalence Code |
|
DIP18,.3
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
IN-LINE, WINDOW
|
| Qualification Status |
|
Not Qualified
|
| RAM (bytes) |
|
80
|
| ROM (words) |
|
512
|
| ROM Programmability |
|
UVPROM
|
| Seated Height-Max |
|
4.83 mm
|
| Speed |
|
20 MHz
|
| Supply Current-Max |
|
20 mA
|
| Supply Voltage-Max |
|
5.5 V
|
| Supply Voltage-Min |
|
5 V
|
| Supply Voltage-Nom |
|
5 V
|
| Surface Mount |
|
NO
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Finish |
|
MATTE TIN
|
| Terminal Form |
|
THROUGH-HOLE
|
| Terminal Pitch |
|
2.54 mm
|
| Terminal Position |
|
DUAL
|
| Width |
|
7.62 mm
|
|
|
|
Compare PIC16C554T-04I/SS301 with alternatives
Compare PIC16C554/JW with alternatives