PIC16C554-20IP
vs
PIC16C554-20/P
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Not Recommended
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
DIP
DIP
Package Description
DIP,
0.300 INCH, PLASTIC, DIP-18
Pin Count
18
18
Reach Compliance Code
compliant
compliant
Has ADC
NO
NO
Address Bus Width
Bit Size
8
8
Clock Frequency-Max
20 MHz
20 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
R-PDIP-T18
R-PDIP-T18
JESD-609 Code
e3
e3
Length
22.73 mm
22.73 mm
Number of I/O Lines
13
13
Number of Terminals
18
18
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
PWM Channels
NO
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Qualification Status
Not Qualified
Not Qualified
ROM Programmability
OTPROM
OTPROM
Seated Height-Max
3.94 mm
3.94 mm
Speed
20 MHz
20 MHz
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
7.62 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
1
1
ECCN Code
EAR99
HTS Code
8542.31.00.01
Samacsys Manufacturer
Microchip
CPU Family
PIC
On Chip Program ROM Width
14
Package Equivalence Code
DIP18,.3
RAM (bytes)
80
ROM (words)
512
Supply Current-Max
20 mA
Compare PIC16C554-20IP with alternatives
Compare PIC16C554-20/P with alternatives