PIC16C55-XTI/S301
vs
PIC16C55-XTI/SS
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Not Recommended
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
DIE,
SSOP, SSOP28,.3
Reach Compliance Code
compliant
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
NO
NO
Address Bus Width
Bit Size
8
8
Boundary Scan
NO
NO
CPU Family
PIC
PIC16
Clock Frequency-Max
4 MHz
4 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
X-XUUC-N
R-PDSO-G28
Number of Timers
1
1
On Chip Program ROM Width
12
12
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
NO
NO
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
DIE
SSOP
Package Shape
UNSPECIFIED
RECTANGULAR
Package Style
UNCASED CHIP
SMALL OUTLINE, SHRINK PITCH
ROM (words)
512
512
ROM Programmability
EPROM
OTPROM
Speed
40 MHz
4 MHz
Supply Voltage-Max
6.25 V
6.25 V
Supply Voltage-Min
3 V
3.25 V
Supply Voltage-Nom
3.25 V
3.25 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
NO LEAD
GULL WING
Terminal Position
UPPER
DUAL
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
2
8
Pbfree Code
Rohs Code
Part Package Code
SSOP
Pin Count
28
ECCN Code
EAR99
Factory Lead Time
6 Weeks
Samacsys Manufacturer
Microchip
Format
FIXED POINT
Integrated Cache
NO
JESD-609 Code
e3
Length
10.2 mm
Low Power Mode
YES
Moisture Sensitivity Level
1
Number of I/O Lines
20
Number of Terminals
28
On Chip Data RAM Width
8
Package Equivalence Code
SSOP28,.3
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
RAM (bytes)
24
RAM (words)
24
Seated Height-Max
1.98 mm
Supply Current-Max
3.3 mA
Terminal Finish
Matte Tin (Sn)
Terminal Pitch
0.65 mm
Width
5.25 mm
Compare PIC16C55-XTI/S301 with alternatives
Compare PIC16C55-XTI/SS with alternatives