PIC16C55-RC/JW301
vs
PIC16C55-RCSP
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Not Recommended
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
DIP-28
|
DIP, DIP28,.3
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Date Of Intro |
2017-12-19
|
1990-01-01
|
| Has ADC |
NO
|
NO
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| Boundary Scan |
NO
|
NO
|
| CPU Family |
PIC
|
PIC
|
| Clock Frequency-Max |
40 MHz
|
4 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-CDIP-T28
|
R-PDIP-T28
|
| Length |
37.08 mm
|
34.67 mm
|
| Number of DMA Channels |
|
|
| Number of I/O Lines |
20
|
20
|
| Number of Terminals |
28
|
28
|
| Number of Timers |
1
|
1
|
| On Chip Program ROM Width |
12
|
12
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| PWM Channels |
NO
|
NO
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
WDIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE, WINDOW
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| ROM (words) |
512
|
512
|
| ROM Programmability |
UVPROM
|
EPROM
|
| Seated Height-Max |
5.72 mm
|
4.06 mm
|
| Speed |
40 MHz
|
40 MHz
|
| Supply Voltage-Max |
6.25 V
|
6.25 V
|
| Supply Voltage-Min |
5 V
|
3.25 V
|
| Supply Voltage-Nom |
5 V
|
3.25 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
15.24 mm
|
7.62 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
28
|
| JESD-609 Code |
|
e3
|
| On Chip Data RAM Width |
|
8
|
| Package Equivalence Code |
|
DIP28,.3
|
| Qualification Status |
|
Not Qualified
|
| RAM (bytes) |
|
24
|
| RAM (words) |
|
24
|
| Screening Level |
|
ISO/TS-16949
|
| Supply Current-Max |
|
3.3 mA
|
| Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare PIC16C55-RC/JW301 with alternatives
Compare PIC16C55-RCSP with alternatives