PIC16C54-LPE/JW
vs
PIC16C54-LPS/SO
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Not Recommended
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
DIP
SOIC
Package Description
DIP, DIP18,.3
0.300 INCH, PLASTIC, SOIC-18
Pin Count
18
18
Reach Compliance Code
compliant
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
NO
NO
Address Bus Width
Bit Size
8
8
Boundary Scan
NO
NO
CPU Family
PIC
PIC
Clock Frequency-Max
0.2 MHz
0.04 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
R-CDIP-T18
R-PDSO-G18
Length
22.987 mm
11.53 mm
Number of DMA Channels
Number of I/O Lines
12
12
Number of Terminals
18
18
Number of Timers
1
1
On Chip Program ROM Width
8
12
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
NO
NO
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP18,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
25
25
ROM (words)
512
512
ROM Programmability
UVPROM
OTPROM
Screening Level
ISO/TS-16949
Speed
0.01 MHz
0.25 MHz
Supply Voltage-Max
6.25 V
6.25 V
Supply Voltage-Min
2.5 V
5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
1
1
Pbfree Code
Yes
Rohs Code
Yes
Additional Feature
ROM PROTECT; ICC_MAX AT FOSC = 32KHZ
Format
FIXED POINT
Integrated Cache
NO
JESD-609 Code
e3
Low Power Mode
YES
Moisture Sensitivity Level
1
Number of External Interrupts
Number of Serial I/Os
On Chip Data RAM Width
8
RAM (words)
25
Supply Current-Max
0.04 mA
Terminal Finish
Matte Tin (Sn)
Compare PIC16C54-LPE/JW with alternatives
Compare PIC16C54-LPS/SO with alternatives