PIC12F1612-E/ML
vs
PIC12F1612T-I/RF
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Bit Size |
8
|
8
|
On Chip Program ROM Width |
8
|
8
|
ROM (words) |
3584
|
3584
|
ROM Programmability |
FLASH
|
FLASH
|
Speed |
32 MHz
|
32 MHz
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
2.3 V
|
2.5 V
|
Supply Voltage-Nom |
3 V
|
3 V
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
1
|
1
|
Package Description |
|
UDFN-8
|
ECCN Code |
|
3A991.A.2
|
Has ADC |
|
YES
|
Additional Feature |
|
ALSO OPERATES WITH 2.3V MIN@16 MHZ
|
Address Bus Width |
|
|
Clock Frequency-Max |
|
32 MHz
|
DAC Channels |
|
YES
|
DMA Channels |
|
NO
|
External Data Bus Width |
|
|
JESD-30 Code |
|
S-PDSO-N8
|
Length |
|
3 mm
|
Number of I/O Lines |
|
6
|
Number of Terminals |
|
8
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
PWM Channels |
|
YES
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
HVSON
|
Package Shape |
|
SQUARE
|
Package Style |
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Screening Level |
|
TS 16949
|
Seated Height-Max |
|
0.55 mm
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Form |
|
NO LEAD
|
Terminal Pitch |
|
0.65 mm
|
Terminal Position |
|
DUAL
|
Width |
|
3 mm
|
|
|
|
Compare PIC12F1612-E/ML with alternatives
Compare PIC12F1612T-I/RF with alternatives