PIC10F200-E/PG
vs
PIC10F200T-I/MC
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
PDIP-8
|
2 X 3 MM, 0.90 MM HEIGHT, LEAD FREE, MO-229VCED-2, DFN-8
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
NO
|
NO
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| Boundary Scan |
NO
|
NO
|
| CPU Family |
PIC10
|
PIC10
|
| Clock Frequency-Max |
4 MHz
|
4.2 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
NO
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDSO-N8
|
| Length |
9.46 mm
|
3 mm
|
| Low Power Mode |
NO
|
YES
|
| Number of DMA Channels |
|
|
| Number of External Interrupts |
|
|
| Number of I/O Lines |
4
|
4
|
| Number of Serial I/Os |
|
|
| Number of Terminals |
8
|
8
|
| Number of Timers |
1
|
2
|
| On Chip Data RAM Width |
8
|
8
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
NO
|
NO
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
HVSON
|
| Package Equivalence Code |
DIP8,.3
|
SOLCC8,.12,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| RAM (bytes) |
16
|
16
|
| RAM (words) |
16
|
|
| ROM (words) |
384
|
384
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
4.32 mm
|
1 mm
|
| Speed |
4 MHz
|
4 MHz
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
2 V
|
2 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
2 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
SON
|
| Pin Count |
|
8
|
| ECCN Code |
|
EAR99
|
| Factory Lead Time |
|
7 Weeks
|
| Samacsys Manufacturer |
|
Microchip
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Screening Level |
|
TS 16949
|
| Supply Current-Max |
|
1.1 mA
|
| Terminal Finish |
|
Matte Tin (Sn)
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare PIC10F200-E/PG with alternatives
Compare PIC10F200T-I/MC with alternatives