PI74STX1G32CX
vs
SN74LVC1G32DCKJ
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
PERICOM SEMICONDUCTOR CORP
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
TSSOP, TSSOP5/6,.08
|
TSSOP, TSSOP5/6,.08
|
Pin Count |
5
|
5
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
STX
|
LVC/LCX/Z
|
JESD-30 Code |
R-PDSO-G5
|
R-PDSO-G5
|
JESD-609 Code |
e0
|
e4
|
Length |
2 mm
|
2 mm
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
OR GATE
|
OR GATE
|
Max I(ol) |
0.024 A
|
0.024 A
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Inputs |
2
|
2
|
Number of Terminals |
5
|
5
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Equivalence Code |
TSSOP5/6,.08
|
TSSOP5/6,.08
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Packing Method |
TR
|
TR
|
Prop. Delay@Nom-Sup |
5.1 ns
|
4.5 ns
|
Propagation Delay (tpd) |
7.7 ns
|
8 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Schmitt Trigger |
NO
|
NO
|
Seated Height-Max |
1.1 mm
|
1.1 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
1.65 V
|
1.65 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
1.25 mm
|
1.25 mm
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Peak Reflow Temperature (Cel) |
|
260
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare PI74STX1G32CX with alternatives
Compare SN74LVC1G32DCKJ with alternatives