PI74STEX2GU04CEX
vs
74AUP1G3208GW
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
PERICOM SEMICONDUCTOR CORP
NXP SEMICONDUCTORS
Part Package Code
SOIC
SOT-363
Package Description
TSSOP,
TSSOP, TSSOP6,.08
Pin Count
6
6
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
STEX
AUP/ULP/V
JESD-30 Code
R-PDSO-G6
R-PDSO-G6
JESD-609 Code
e3
e3
Length
2 mm
2 mm
Logic IC Type
INVERTER
OR-AND GATE
Moisture Sensitivity Level
1
1
Number of Functions
2
1
Number of Inputs
1
3
Number of Terminals
6
6
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)
11 ns
20.1 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
3.6 V
Supply Voltage-Min (Vsup)
1.65 V
0.8 V
Supply Voltage-Nom (Vsup)
1.8 V
1.1 V
Surface Mount
YES
YES
Technology
TTL
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
MATTE TIN
Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
1.25 mm
1.25 mm
Base Number Matches
1
2
Load Capacitance (CL)
30 pF
Max I(ol)
0.0017 A
Package Equivalence Code
TSSOP6,.08
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
20.1 ns
Schmitt Trigger
NO
Time@Peak Reflow Temperature-Max (s)
30
Compare PI74STEX2GU04CEX with alternatives
Compare 74AUP1G3208GW with alternatives