PI74SSTV32852NB
vs
CSSTV32852GKFREP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
PERICOM SEMICONDUCTOR CORP
TEXAS INSTRUMENTS INC
Part Package Code
BGA
BGA
Package Description
LFBGA, BGA114,6X19,32
PLASTIC, LFBGA-114
Pin Count
114
114
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
SSTV
SSTV
JESD-30 Code
R-PBGA-B114
R-PBGA-B114
JESD-609 Code
e0
e0
Length
16 mm
15.5 mm
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
24
1
Number of Functions
1
1
Number of Terminals
114
114
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA114,6X19,32
BGA114,6X19,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Propagation Delay (tpd)
3.3 ns
3.1 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.45 mm
1.4 mm
Supply Voltage-Max (Vsup)
2.7 V
2.7 V
Supply Voltage-Min (Vsup)
2.3 V
2.3 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
TTL
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
5.5 mm
5.5 mm
fmax-Min
200 MHz
200 MHz
Base Number Matches
1
1
Samacsys Manufacturer
Texas Instruments
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
220
Time@Peak Reflow Temperature-Max (s)
20
Trigger Type
POSITIVE EDGE
Compare PI74SSTV32852NB with alternatives
Compare CSSTV32852GKFREP with alternatives