PI74SSTU32864NB
vs
SSTUAF32865AHLF
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
PERICOM SEMICONDUCTOR CORP
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
BGA
|
CABGA
|
Package Description |
LFBGA, BGA96,6X16,32
|
LEAD FREE, BGA-160
|
Pin Count |
96
|
160
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
14 BIT 1:2 CONFIGURATION ALSO POSSIBLE
|
|
Family |
SSTU
|
32865
|
JESD-30 Code |
R-PBGA-B96
|
R-PBGA-B160
|
JESD-609 Code |
e0
|
e1
|
Length |
13.5 mm
|
13 mm
|
Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
Moisture Sensitivity Level |
3
|
3
|
Number of Bits |
25
|
25
|
Number of Functions |
1
|
1
|
Number of Terminals |
96
|
160
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LFBGA
|
Package Equivalence Code |
BGA96,6X16,32
|
BGA160,12X18,25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Propagation Delay (tpd) |
2.35 ns
|
1.9 ns
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.4 mm
|
1.3 mm
|
Supply Voltage-Max (Vsup) |
1.9 V
|
1.9 V
|
Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.65 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
Width |
5.5 mm
|
9 mm
|
fmax-Min |
270 MHz
|
410 MHz
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Manufacturer Package Code |
|
BKG160
|
Peak Reflow Temperature (Cel) |
|
260
|
|
|
|
Compare PI74SSTU32864NB with alternatives
Compare SSTUAF32865AHLF with alternatives