PI74LVC257AL
vs
MC74LCX257MR2
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
PERICOM SEMICONDUCTOR CORP
|
ON SEMICONDUCTOR
|
Part Package Code |
TSSOP
|
SOIC
|
Package Description |
TSSOP, TSSOP16,.25
|
SOP,
|
Pin Count |
16
|
16
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
LVC/LCX/Z
|
LVC/LCX/Z
|
JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
JESD-609 Code |
e0
|
e0
|
Length |
5 mm
|
10.2 mm
|
Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
Max I(ol) |
0.024 A
|
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
4
|
4
|
Number of Inputs |
2
|
2
|
Number of Outputs |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
SOP
|
Package Equivalence Code |
TSSOP16,.25
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
Packing Method |
TUBE
|
|
Prop. Delay@Nom-Sup |
4.6 ns
|
|
Propagation Delay (tpd) |
13.4 ns
|
7.2 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
2.05 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
1.65 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
4.4 mm
|
5.275 mm
|
Base Number Matches |
2
|
1
|
|
|
|
Compare PI74LVC257AL with alternatives
Compare MC74LCX257MR2 with alternatives