PI74LPT16543CV
vs
74LVT16543ADL,518
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
PERICOM SEMICONDUCTOR CORP
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SSOP
|
SSOP
|
| Package Description |
SSOP, SSOP56,.4
|
PLASTIC, SSOP3-56
|
| Pin Count |
56
|
56
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION
|
WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION
|
| Control Type |
ENABLE LOW
|
INDEPENDENT CONTROL
|
| Count Direction |
BIDIRECTIONAL
|
BIDIRECTIONAL
|
| Family |
LPT
|
LVT
|
| JESD-30 Code |
R-PDSO-G56
|
R-PDSO-G56
|
| JESD-609 Code |
e0
|
e4
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
REGISTERED BUS TRANSCEIVER
|
REGISTERED BUS TRANSCEIVER
|
| Max I(ol) |
0.024 A
|
0.032 A
|
| Number of Bits |
8
|
8
|
| Number of Functions |
2
|
2
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
56
|
56
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
INVERTED
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Equivalence Code |
TSSOP56,.3,20
|
SSOP56,.4
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Power Supply Current-Max (ICC) |
4.7 mA
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
BICMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
2
|
2
|
| Manufacturer Package Code |
|
SOT371-1
|
| Factory Lead Time |
|
4 Weeks
|
| Length |
|
18.425 mm
|
| Moisture Sensitivity Level |
|
2
|
| Package Code |
|
SSOP
|
| Package Style |
|
SMALL OUTLINE, SHRINK PITCH
|
| Packing Method |
|
TR
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Propagation Delay (tpd) |
|
6.2 ns
|
| Seated Height-Max |
|
2.8 mm
|
| Terminal Pitch |
|
0.635 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
7.5 mm
|
|
|
|
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