PI6C182HE
vs
MPC949FA
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
PERICOM SEMICONDUCTOR CORP
|
MOTOROLA INC
|
| Part Package Code |
SSOP
|
QFP
|
| Package Description |
SSOP,
|
LQFP, QFP52,.47SQ
|
| Pin Count |
28
|
52
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
6C
|
MPC900
|
| Input Conditioning |
STANDARD
|
DIFFERENTIAL MUX
|
| JESD-30 Code |
R-PDSO-G28
|
S-PQFP-G52
|
| JESD-609 Code |
e3
|
e0
|
| Length |
10.2 mm
|
10 mm
|
| Logic IC Type |
LOW SKEW CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
28
|
52
|
| Number of True Outputs |
10
|
15
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SSOP
|
LQFP
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
FLATPACK, LOW PROFILE
|
| Propagation Delay (tpd) |
5.5 ns
|
10.6 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Same Edge Skew-Max (tskwd) |
0.25 ns
|
0.35 ns
|
| Seated Height-Max |
2 mm
|
1.7 mm
|
| Supply Voltage-Max (Vsup) |
3.465 V
|
3.465 V
|
| Supply Voltage-Min (Vsup) |
3.135 V
|
3.135 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
5.3 mm
|
10 mm
|
| fmax-Min |
110 MHz
|
160 MHz
|
| Base Number Matches |
1
|
4
|
| Max I(ol) |
|
0.02 A
|
| Package Equivalence Code |
|
QFP52,.47SQ
|
|
|
|
Compare PI6C182HE with alternatives
Compare MPC949FA with alternatives