PI3CH360LEX
vs
SN74LV157ADGVRE4
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
DIODES INC
TEXAS INSTRUMENTS INC
Package Description
,
TSSOP, TSSOP16,.25,16
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Diodes Incorporated
JESD-609 Code
e3
e4
Logic IC Type
MULTIPLEXER AND DEMUX/DECODER
MULTIPLEXER
Moisture Sensitivity Level
1
1
Peak Reflow Temperature (Cel)
260
260
Terminal Finish
MATTE TIN
NICKEL PALLADIUM GOLD
Time@Peak Reflow Temperature-Max (s)
30
30
Base Number Matches
1
1
Pbfree Code
Part Package Code
SOIC
Pin Count
16
Family
LV/LV-A/LVX/H
JESD-30 Code
R-PDSO-G16
Length
4.4 mm
Load Capacitance (CL)
50 pF
Max I(ol)
0.006 A
Number of Functions
4
Number of Inputs
2
Number of Outputs
1
Number of Terminals
16
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Output Polarity
TRUE
Package Body Material
PLASTIC/EPOXY
Package Code
TSSOP
Package Equivalence Code
TSSOP16,.25,16
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method
TR
Prop. Delay@Nom-Sup
15 ns
Propagation Delay (tpd)
22 ns
Qualification Status
Not Qualified
Seated Height-Max
1.2 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
2 V
Supply Voltage-Nom (Vsup)
2.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
GULL WING
Terminal Pitch
0.4 mm
Terminal Position
DUAL
Width
3.6 mm
Compare PI3CH360LEX with alternatives
Compare SN74LV157ADGVRE4 with alternatives