PI3C3245LEX
vs
FSTU3125M
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
PERICOM SEMICONDUCTOR CORP
|
ROCHESTER ELECTRONICS INC
|
| Part Package Code |
TSSOP
|
SOIC
|
| Package Description |
TSSOP,
|
SOP,
|
| Pin Count |
20
|
14
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Family |
CB3Q/3VH/3C/2B
|
CBT/FST/QS/5C/B
|
| JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G14
|
| JESD-609 Code |
e3
|
|
| Length |
6.5 mm
|
8.65 mm
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
8
|
4
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
20
|
14
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
0.25 ns
|
0.25 ns
|
| Qualification Status |
Not Qualified
|
COMMERCIAL
|
| Seated Height-Max |
1.2 mm
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
3.63 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.97 V
|
4 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
4.4 mm
|
3.9 mm
|
| Base Number Matches |
2
|
2
|
| Technology |
|
CMOS
|
|
|
|
Compare PI3C3245LEX with alternatives
Compare FSTU3125M with alternatives