PI3B16213AX
vs
PI3B4010NE
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
PERICOM SEMICONDUCTOR CORP
PERICOM SEMICONDUCTOR CORP
Part Package Code
TSSOP
BGA
Package Description
TSSOP,
TFBGA,
Pin Count
56
64
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
BUS SWITCH
Family
CBTLV/3B
CBTLV/3B
JESD-30 Code
R-PDSO-G56
S-PBGA-B64
Length
14 mm
7 mm
Logic IC Type
BUS EXCHANGER
BUS EXCHANGER
Number of Bits
2
10
Number of Functions
12
4
Number of Ports
4
5
Number of Terminals
56
64
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TFBGA
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
0.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.465 V
Supply Voltage-Min (Vsup)
3 V
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
6.1 mm
7 mm
Base Number Matches
1
1
Pbfree Code
JESD-609 Code
e1
Moisture Sensitivity Level
3
Package Equivalence Code
BGA64,11X11,20
Terminal Finish
TIN SILVER COPPER
Compare PI3B16213AX with alternatives
Compare PI3B4010NE with alternatives