PHT11N06T/T3 vs PHT8N06LT,135 feature comparison

PHT11N06T/T3 NXP Semiconductors

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PHT8N06LT,135 NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description SMALL OUTLINE, R-PDSO-G4 PLASTIC, SOT-223, 4 PIN
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
Additional Feature ESD PROTECTED LOGIC LEVEL COMPATIBLE, ESD PROTECTED
Avalanche Energy Rating (Eas) 60 mJ 30 mJ
Case Connection DRAIN DRAIN
Configuration SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min 55 V 55 V
Drain Current-Max (ID) 4.9 A 2.2 A
Drain-source On Resistance-Max 0.04 Ω 0.08 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
JESD-30 Code R-PDSO-G4 R-PDSO-G4
Number of Elements 1 1
Number of Terminals 4 4
Operating Mode ENHANCEMENT MODE ENHANCEMENT MODE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Polarity/Channel Type N-CHANNEL N-CHANNEL
Pulsed Drain Current-Max (IDM) 19 A 40 A
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Base Number Matches 1 2
Rohs Code Yes
Part Package Code SC-73
Pin Count 4
Manufacturer Package Code SOT223
HTS Code 8541.29.00.75
JESD-609 Code e3
Moisture Sensitivity Level 1
Operating Temperature-Max 150 °C
Peak Reflow Temperature (Cel) 260
Power Dissipation-Max (Abs) 1.8 W
Terminal Finish TIN
Time@Peak Reflow Temperature-Max (s) 30

Compare PHT11N06T/T3 with alternatives

Compare PHT8N06LT,135 with alternatives