PH28F320W18TD60
vs
M58WR032HB60ZB6E
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NUMONYX
NUMONYX
Part Package Code
BGA
BGA
Package Description
9 X 7.70 MM, 1 MM HEIGHT, LEAD FREE, VFBGA-56
7.70 X 9 MM, 0.75 MM PITCH, LEAD FREE, VFBGA-56
Pin Count
56
56
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
60 ns
60 ns
Additional Feature
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
100,000 PROGRAM/ERASE CYCLES; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
Boot Block
TOP
BOTTOM
JESD-30 Code
R-PBGA-B56
R-PBGA-B56
Length
9 mm
9 mm
Memory Density
33554432 bit
33554432 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
56
56
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
2MX16
2MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
VFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Programming Voltage
1.8 V
1.8 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
1 mm
Supply Voltage-Max (Vsup)
1.95 V
2 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.75 mm
0.75 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
40
Type
NOR TYPE
NOR TYPE
Width
7.7 mm
7.7 mm
Base Number Matches
3
2
JESD-609 Code
e1
Terminal Finish
TIN SILVER COPPER
Compare PH28F320W18TD60 with alternatives
Compare M58WR032HB60ZB6E with alternatives