PGR5116
vs
MCP2562T-H/MF
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Not Recommended
Ihs Manufacturer
ERICSSON POWER MODULES AB
MICROCHIP TECHNOLOGY INC
Part Package Code
MODULE
Package Description
40 X 25 X 9 MM, MODULE
3 X 3 MM, 0.90 MM HEIGHT, PLASTIC, DFN-8
Pin Count
18
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-XXFO-X
S-PDSO-N8
Number of Functions
1
1
Number of Terminals
18
8
Operating Temperature-Max
85 °C
150 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
XFO
HVSON
Package Shape
RECTANGULAR
SQUARE
Package Style
FIBER OPTIC
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Qualification Status
Not Qualified
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Telecom IC Type
SUPPORT CIRCUIT
CAN TRANSCEIVER
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
UNSPECIFIED
NO LEAD
Terminal Position
UNSPECIFIED
DUAL
Base Number Matches
1
1
Rohs Code
ECCN Code
EAR99
Factory Lead Time
4 Weeks
Samacsys Manufacturer
Microchip
Data Rate
1000 Mbps
JESD-609 Code
e3
Length
3 mm
Moisture Sensitivity Level
1
Number of Transceivers
1
Package Equivalence Code
SOLCC8,.12,25
Peak Reflow Temperature (Cel)
260
Screening Level
TS 16949
Seated Height-Max
1 mm
Supply Current-Max
70 mA
Terminal Finish
MATTE TIN
Terminal Pitch
0.65 mm
Time@Peak Reflow Temperature-Max (s)
40
Width
3 mm
Compare PGR5116 with alternatives
Compare MCP2562T-H/MF with alternatives