PF48F5500M0Y0B0 vs PF58F0031M0Y1BE feature comparison

PF48F5500M0Y0B0 Intel Corporation

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PF58F0031M0Y1BE Intel Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEL CORP INTEL CORP
Part Package Code BGA BGA
Package Description 8 X 10 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, SCSP-105 TFBGA,
Pin Count 105 105
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 108 MHz 108 MHz
JESD-30 Code R-PBGA-B105 R-PBGA-B105
JESD-609 Code e1 e1
Length 10 mm 15 mm
Memory Density 1073741824 bit 1073741824 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Mixed Memory Type FLASH+PSRAM
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 105 105
Number of Words 67108864 words 67108864 words
Number of Words Code 64000000 64000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Organization 64MX16 64MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA TFBGA
Package Equivalence Code BGA105,9X12,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 1.8 V 1.8 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.2 mm
Standby Current-Max 0.00012 A
Supply Voltage-Max (Vsup) 2 V 2 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN SILVER COPPER Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE MLC NAND TYPE
Width 8 mm 11 mm
Base Number Matches 1 1
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40

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Compare PF58F0031M0Y1BE with alternatives