PF38F5566MMY0C0
vs
M36P0R8070E0ZACF
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
NUMONYX
|
NUMONYX
|
Part Package Code |
BGA
|
BGA
|
Package Description |
LFBGA,
|
TFBGA, BGA107,9X12,32
|
Pin Count |
107
|
107
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.71
|
8542.32.00.71
|
Additional Feature |
PSEUDO SRAM IS ORGANIZED AS 16M X 16
|
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; PSRAM IS ORGANISED AS 8M X 16
|
JESD-30 Code |
R-PBGA-B107
|
R-PBGA-B107
|
Length |
11 mm
|
11 mm
|
Memory Density |
1073741824 bit
|
268435456 bit
|
Memory IC Type |
MEMORY CIRCUIT
|
MEMORY CIRCUIT
|
Memory Width |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Terminals |
107
|
107
|
Number of Words |
67108864 words
|
16777216 words
|
Number of Words Code |
64000000
|
16000000
|
Operating Mode |
SYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-30 °C
|
-30 °C
|
Organization |
64MX16
|
16MX16
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
TFBGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.4 mm
|
1.2 mm
|
Supply Voltage-Max (Vsup) |
2 V
|
1.95 V
|
Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Width |
8 mm
|
8 mm
|
Base Number Matches |
2
|
3
|
Rohs Code |
|
Yes
|
Access Time-Max |
|
93 ns
|
Mixed Memory Type |
|
FLASH+PSRAM
|
Package Equivalence Code |
|
BGA107,9X12,32
|
|
|
|
Compare PF38F5566MMY0C0 with alternatives