PF38F4050M0Y0C0 vs PF38F5566MMY0C0 feature comparison

PF38F4050M0Y0C0 Numonyx Memory Solutions

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PF38F5566MMY0C0 Intel Corporation

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NUMONYX INTEL CORP
Part Package Code BGA BGA
Package Description TFBGA, LFBGA, BGA107,9X12,32
Pin Count 107 107
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Additional Feature PSEUDO SRAM IS ORGANIZED AS 4M X 16 PSEUDO SRAM IS ORGANIZED AS 16M X 16
JESD-30 Code R-PBGA-B107 R-PBGA-B107
Length 11 mm 11 mm
Memory Density 268435456 bit 1073741824 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 107 107
Number of Words 16777216 words 67108864 words
Number of Words Code 16000000 64000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -30 °C -30 °C
Organization 16MX16 64MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA LFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.4 mm
Supply Voltage-Max (Vsup) 2 V 2 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 8 mm 8 mm
Base Number Matches 2 2
Rohs Code Yes
JESD-609 Code e1
Mixed Memory Type FLASH+PSRAM
Moisture Sensitivity Level 3
Package Equivalence Code BGA107,9X12,32
Standby Current-Max 0.00012 A
Terminal Finish TIN SILVER COPPER

Compare PF38F4050M0Y0C0 with alternatives

Compare PF38F5566MMY0C0 with alternatives