PF38F30L0Y0Q0 vs AM29LV128MH104PCI feature comparison

PF38F30L0Y0Q0 Intel Corporation

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AM29LV128MH104PCI AMD

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Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEL CORP ADVANCED MICRO DEVICES INC
Part Package Code BGA BGA
Package Description 8 X 10 MM, 1.20 MM HEIGHT, ROHS COMPLIANT, VFBGA-88 13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-64
Pin Count 64 64
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 54 MHz
JESD-30 Code R-PBGA-B64 R-PBGA-B64
JESD-609 Code e1 e0
Length 10 mm 13 mm
Memory Density 134217728 bit 134217728 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -40 °C
Organization 8MX16 8MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE
Parallel/Serial SERIAL PARALLEL
Programming Voltage 1.8 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.4 mm
Supply Voltage-Max (Vsup) 2 V 3.6 V
Supply Voltage-Min (Vsup) 1.7 V 2.7 V
Supply Voltage-Nom (Vsup) 1.8 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN SILVER COPPER Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 1 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE NOR TYPE
Width 8 mm 11 mm
Base Number Matches 2 2
Access Time-Max 100 ns
Alternate Memory Width 8
Boot Block BOTTOM/TOP
Command User Interface YES
Common Flash Interface YES
Data Polling YES
Number of Sectors/Size 256
Package Equivalence Code BGA64,8X8,40
Page Size 4/8 words
Ready/Busy YES
Sector Size 64K
Standby Current-Max 0.000005 A
Supply Current-Max 0.06 mA
Toggle Bit YES

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