PF38F2040W0YTQ0 vs RD38F2030W0YTQ2 feature comparison

PF38F2040W0YTQ0 Intel Corporation

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RD38F2030W0YTQ2 Intel Corporation

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEL CORP INTEL CORP
Part Package Code BGA BGA
Package Description TFBGA, BGA88,8X12,32 TFBGA, BGA88,8X12,32
Pin Count 88 88
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 70 ns 70 ns
Additional Feature CONTAINS 32 MBIT SRAM, ALSO CONTAINS 64 MBIT FLASH CONTAINS 16 MBIT PSRAM, ALSO CONTAINS 64 MBIT FLASH
JESD-30 Code R-PBGA-B88 R-PBGA-B88
JESD-609 Code e1 e0
Length 10 mm 10 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Mixed Memory Type FLASH+PSRAM+SRAM FLASH+PSRAM+SRAM
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 88 88
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -25 °C
Organization 4MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Equivalence Code BGA88,8X12,32 BGA88,8X12,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Standby Current-Max 0.000045 A 0.0001 A
Supply Current-Max 0.055 mA 0.055 mA
Supply Voltage-Max (Vsup) 1.95 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 8 mm
Base Number Matches 3 3

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