PF38F1030W0ZBQ0
vs
MT28C256564W18DBT-F70P70BTWT
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEL CORP
MICRON TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
TFBGA, BGA88,8X12,32
LFBGA,
Pin Count
88
88
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
70 ns
Additional Feature
CONTAINS 16 MBIT SRAM, ALSO CONTAINS 64 MBIT FLASH
CELLULARRAM IS ORGANIZED AS 4M X 16; CONTAINS ADDITIONAL 8M X 16 FLASH
JESD-30 Code
R-PBGA-B88
R-PBGA-B88
JESD-609 Code
e1
e1
Length
10 mm
12 mm
Memory Density
67108864 bit
134217728 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
16
16
Mixed Memory Type
FLASH+PSRAM+SRAM
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
88
88
Number of Words
4194304 words
8388608 words
Number of Words Code
4000000
8000000
Operating Mode
SYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-25 °C
-25 °C
Organization
4MX16
8MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
LFBGA
Package Equivalence Code
BGA88,8X12,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.4 mm
Standby Current-Max
0.000045 A
Supply Current-Max
0.055 mA
Supply Voltage-Max (Vsup)
1.95 V
1.95 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
8 mm
9 mm
Base Number Matches
3
1
Compare PF38F1030W0ZBQ0 with alternatives
Compare MT28C256564W18DBT-F70P70BTWT with alternatives