PEMD9
vs
NSBC114TDXV6T1G
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
ONSEMI
Package Description
PLASTIC PACKAGE-6
PLASTIC, CASE 463A-01, 6 PIN
Pin Count
6
6
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
Additional Feature
BUILT-IN BIAS RESISTOR RATIO IS 4.7
BUILT IN BIAS RESISTOR
Collector Current-Max (IC)
0.1 A
0.1 A
Collector-Emitter Voltage-Max
50 V
50 V
Configuration
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR
DC Current Gain-Min (hFE)
100
160
JESD-30 Code
R-PDSO-F6
R-PDSO-F6
JESD-609 Code
e3
e3
Moisture Sensitivity Level
1
1
Number of Elements
2
2
Number of Terminals
6
6
Operating Temperature-Max
150 °C
150 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
260
Polarity/Channel Type
NPN AND PNP
NPN
Power Dissipation-Max (Abs)
0.2 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Terminal Finish
Tin (Sn)
Matte Tin (Sn) - annealed
Terminal Form
FLAT
FLAT
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Transistor Application
SWITCHING
SWITCHING
Transistor Element Material
SILICON
SILICON
Base Number Matches
3
1
Part Package Code
SOT-563, 6 LEAD
Manufacturer Package Code
463A-01
Factory Lead Time
10 Weeks
Samacsys Manufacturer
onsemi
Operating Temperature-Min
-55 °C
VCEsat-Max
0.25 V
Compare PEMD9 with alternatives
Compare NSBC114TDXV6T1G with alternatives