PEM1-S5-S15-S
vs
PDS1-S5-S15-M
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
CUI INC
|
CUI INC
|
| Part Package Code |
MODULE
|
MODULE
|
| Package Description |
,
|
SMT-8/5
|
| Pin Count |
7/5
|
8/5
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Samacsys Manufacturer |
CUI Inc.
|
CUI Inc.
|
| Analog IC - Other Type |
DC-DC UNREGULATED POWER SUPPLY MODULE
|
DC-DC UNREGULATED POWER SUPPLY MODULE
|
| Input Voltage-Max |
5.5 V
|
5.5 V
|
| Input Voltage-Min |
4.5 V
|
4.5 V
|
| Input Voltage-Nom |
5 V
|
5 V
|
| JESD-30 Code |
R-PSMA-P5
|
R-PDMA-G5
|
| Length |
19.5 mm
|
12.7 mm
|
| Load Regulation-Max |
15%
|
|
| Number of Functions |
1
|
1
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
5
|
5
|
| Operating Temperature-Max |
85 °C
|
100 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Voltage-Nom |
15 V
|
15 V
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
| Peak Reflow Temperature (Cel) |
260
|
245
|
| Seated Height-Max |
9.5 mm
|
7.5 mm
|
| Surface Mount |
NO
|
YES
|
| Technology |
HYBRID
|
HYBRID
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
PIN/PEG
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
SINGLE
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
10
|
|
| Total Power Output-Max |
1 W
|
1 W
|
| Trim/Adjustable Output |
NO
|
NO
|
| Width |
6 mm
|
8.3 mm
|
| Base Number Matches |
1
|
1
|
| Output Current-Max |
|
0.067 A
|
| Package Code |
|
SOP
|
| Package Equivalence Code |
|
GWDIP5/8,.48
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare PEM1-S5-S15-S with alternatives
Compare PDS1-S5-S15-M with alternatives