PEEL16V8SL-25
vs
AMPAL20R4ALDCB
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED CIRCUIT TECHNOLOGY CORP
|
ADVANCED MICRO DEVICES INC
|
| Part Package Code |
SOIC
|
DIP
|
| Package Description |
SOP, SOP20,.4
|
DIP, DIP24,.3
|
| Pin Count |
20
|
24
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK
|
|
| Architecture |
PAL-TYPE
|
PAL-TYPE
|
| Clock Frequency-Max |
37 MHz
|
25 MHz
|
| JESD-30 Code |
R-PDSO-G20
|
R-GDIP-T24
|
| JESD-609 Code |
e0
|
e0
|
| Length |
12.8 mm
|
|
| Number of Dedicated Inputs |
8
|
12
|
| Number of I/O Lines |
8
|
4
|
| Number of Inputs |
18
|
16
|
| Number of Outputs |
8
|
8
|
| Number of Product Terms |
64
|
64
|
| Number of Terminals |
20
|
24
|
| Operating Temperature-Max |
70 °C
|
75 °C
|
| Operating Temperature-Min |
|
|
| Organization |
8 DEDICATED INPUTS, 8 I/O
|
12 DEDICATED INPUTS, 4 I/O
|
| Output Function |
MACROCELL
|
MIXED
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
SOP
|
DIP
|
| Package Equivalence Code |
SOP20,.4
|
DIP24,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Programmable Logic Type |
EE PLD
|
OT PLD
|
| Propagation Delay |
25 ns
|
25 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
|
| Supply Voltage-Max |
5.25 V
|
5.25 V
|
| Supply Voltage-Min |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
TTL
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.5 mm
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare PEEL16V8SL-25 with alternatives
Compare AMPAL20R4ALDCB with alternatives