PDZ27B,115
vs
BZM55C27TR3
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
VISHAY TELEFUNKEN
|
Part Package Code |
SOD
|
MELF
|
Package Description |
PLASTIC, SMD, UMD2, SC-76, 2 PIN
|
O-LELF-R2
|
Pin Count |
2
|
2
|
Manufacturer Package Code |
SOD323
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8541.10.00.50
|
|
Factory Lead Time |
4 Weeks
|
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
Dynamic Impedance-Max |
40 Ω
|
|
JESD-30 Code |
R-PDSO-G2
|
O-LELF-R2
|
JESD-609 Code |
e3
|
e2
|
Moisture Sensitivity Level |
1
|
1
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
GLASS
|
Package Shape |
RECTANGULAR
|
ROUND
|
Package Style |
SMALL OUTLINE
|
LONG FORM
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
0.4 W
|
0.5 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reference Voltage-Nom |
27 V
|
27 V
|
Reverse Current-Max |
0.05 µA
|
|
Surface Mount |
YES
|
YES
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
TIN
|
TIN SILVER
|
Terminal Form |
GULL WING
|
WRAP AROUND
|
Terminal Position |
DUAL
|
END
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Voltage Temp Coeff-Max |
23.4 mV/°C
|
|
Voltage Tol-Max |
2.49%
|
7.037%
|
Working Test Current |
5 mA
|
5 mA
|
Base Number Matches |
2
|
1
|
Additional Feature |
|
LOW NOISE
|
Case Connection |
|
ISOLATED
|
|
|
|
Compare PDZ27B,115 with alternatives
-
PDZ27B,115 vs PDZ27BT/R
-
PDZ27B,115 vs RD27SB-T2
-
PDZ27B,115 vs BZX384-C27,115
-
PDZ27B,115 vs BZX284-C27/T3
-
PDZ27B,115 vs BZX384-C27
-
PDZ27B,115 vs RD27SB-T1
-
PDZ27B,115 vs RD27SB
-
PDZ27B,115 vs BZX284-C27
-
PDZ27B,115 vs BZM55C27TR
Compare BZM55C27TR3 with alternatives