PDTC143EM,315
vs
RN1101
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Active
Ihs Manufacturer
NEXPERIA
TOSHIBA CORP
Part Package Code
DFN
Package Description
1.0 X 0.6 MM, 0.5 MM HEIGHT, ULTRA SMALL, PLASTIC, SC-101, 3 PIN
SMALL OUTLINE, R-PDSO-G3
Pin Count
3
3
Manufacturer Package Code
SOT883
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
Samacsys Manufacturer
Nexperia
Toshiba
Additional Feature
BUILT-IN BIAS RESISTOR RATIO IS 1
BUILT-IN BIAS RESISTOR RATIO IS 1
Case Connection
COLLECTOR
Collector Current-Max (IC)
0.1 A
Collector-Emitter Voltage-Max
50 V
Configuration
SINGLE WITH BUILT-IN RESISTOR
DC Current Gain-Min (hFE)
30
JESD-30 Code
R-PBCC-N3
JESD-609 Code
e3
Moisture Sensitivity Level
1
Number of Elements
1
Number of Terminals
3
Operating Temperature-Max
150 °C
Package Body Material
PLASTIC/EPOXY
Package Shape
RECTANGULAR
Package Style
CHIP CARRIER
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Polarity/Channel Type
NPN
Qualification Status
Not Qualified
Surface Mount
YES
Terminal Finish
TIN
Terminal Form
NO LEAD
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Transistor Application
SWITCHING
Transistor Element Material
SILICON
Base Number Matches
1
26
Pbfree Code
No
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