PDTC123YS
vs
PDTC123TM,315
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
TO-92
|
DFN
|
Package Description |
CYLINDRICAL, O-PBCY-T3
|
PLASTIC, SMD, SC-101, 3 PIN
|
Pin Count |
3
|
3
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
Additional Feature |
BUILT-IN BIAS RESISTOR RATIO 4.5
|
|
Collector Current-Max (IC) |
0.1 A
|
0.1 A
|
Collector-Emitter Voltage-Max |
50 V
|
50 V
|
Configuration |
SINGLE WITH BUILT-IN RESISTOR
|
SINGLE WITH BUILT-IN RESISTOR
|
DC Current Gain-Min (hFE) |
35
|
30
|
JEDEC-95 Code |
TO-92
|
|
JESD-30 Code |
O-PBCY-T3
|
R-PDSO-G3
|
JESD-609 Code |
e3
|
e3
|
Number of Elements |
1
|
1
|
Number of Terminals |
3
|
3
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
ROUND
|
RECTANGULAR
|
Package Style |
CYLINDRICAL
|
SMALL OUTLINE
|
Polarity/Channel Type |
NPN
|
NPN
|
Power Dissipation-Max (Abs) |
0.5 W
|
0.25 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
NO
|
YES
|
Terminal Finish |
Tin (Sn)
|
TIN
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Position |
BOTTOM
|
DUAL
|
Transistor Application |
SWITCHING
|
SWITCHING
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
3
|
2
|
Manufacturer Package Code |
|
SOT883
|
HTS Code |
|
8541.21.00.75
|
Factory Lead Time |
|
4 Weeks
|
Moisture Sensitivity Level |
|
1
|
Operating Temperature-Max |
|
150 °C
|
Peak Reflow Temperature (Cel) |
|
260
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
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