PDTC123JM
vs
PDTC123JMB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
PHILIPS SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
,
1 X 0.60 MM, 0.37 MM HEIGHT, LEADLESS, ULTRA SMALL, PLASTIC, DFN1006B-3, 3 PIN
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
Collector Current-Max (IC)
0.1 A
0.1 A
DC Current Gain-Min (hFE)
100
100
JESD-609 Code
e3
e3
Number of Elements
1
1
Peak Reflow Temperature (Cel)
260
Polarity/Channel Type
NPN
NPN
Power Dissipation-Max (Abs)
0.25 W
Surface Mount
YES
YES
Terminal Finish
MATTE TIN
TIN
Transistor Element Material
SILICON
SILICON
Base Number Matches
3
2
Additional Feature
BUILT IN BIAS RESISTANCE RATIO IS 21
Case Connection
COLLECTOR
Collector-Emitter Voltage-Max
50 V
Configuration
SINGLE WITH BUILT-IN RESISTOR
JESD-30 Code
R-PBCC-N3
Moisture Sensitivity Level
1
Number of Terminals
3
Package Body Material
PLASTIC/EPOXY
Package Shape
RECTANGULAR
Package Style
CHIP CARRIER
Reference Standard
AEC-Q101; IEC-60134
Terminal Form
NO LEAD
Terminal Position
BOTTOM
Transistor Application
SWITCHING
Transition Frequency-Nom (fT)
230 MHz