PDTC123EM
vs
DTA123JM-T2L
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ROHM CO LTD
|
| Part Package Code |
SC-101
|
|
| Package Description |
CHIP CARRIER, R-PBCC-N3
|
SMALL OUTLINE, R-PDSO-F3
|
| Pin Count |
3
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Additional Feature |
BUILT IN BIAS RESISTANCE RATIO IS 1
|
BUILT-IN BIAS RESISTOR RATIO IS 21
|
| Case Connection |
COLLECTOR
|
|
| Collector Current-Max (IC) |
0.1 A
|
0.1 A
|
| Collector-Emitter Voltage-Max |
50 V
|
50 V
|
| Configuration |
SINGLE WITH BUILT-IN RESISTOR
|
SINGLE WITH BUILT-IN RESISTOR
|
| DC Current Gain-Min (hFE) |
30
|
80
|
| JESD-30 Code |
R-PBCC-N3
|
R-PDSO-F3
|
| JESD-609 Code |
e3
|
e2
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Polarity/Channel Type |
NPN
|
PNP
|
| Power Dissipation-Max (Abs) |
0.25 W
|
0.15 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
Tin (Sn)
|
Tin/Copper (Sn/Cu)
|
| Terminal Form |
NO LEAD
|
FLAT
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Transistor Application |
SWITCHING
|
SWITCHING
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Base Number Matches |
3
|
1
|
| Transition Frequency-Nom (fT) |
|
250 MHz
|
|
|
|
Compare PDTC123EM with alternatives
Compare DTA123JM-T2L with alternatives