PDTC123EM,315
vs
PDTC123YMB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NEXPERIA
Part Package Code
DFN
Package Description
1.0 X 0.6 MM, 0.5 MM HEIGHT, LEADLESS ULTRA SMALL, PLASTIC, SC-101, 3 PIN
CHIP CARRIER, R-PBCC-N3
Pin Count
3
Manufacturer Package Code
SOT883
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
Factory Lead Time
4 Weeks
Additional Feature
BUILT-IN BIAS RESISTOR RATIO IS 1
BUILT IN BIAS RESISTANCE RATIO IS 4.5
Case Connection
COLLECTOR
COLLECTOR
Collector Current-Max (IC)
0.1 A
0.1 A
Collector-Emitter Voltage-Max
50 V
50 V
Configuration
SINGLE WITH BUILT-IN RESISTOR
SINGLE WITH BUILT-IN RESISTOR
DC Current Gain-Min (hFE)
30
35
JESD-30 Code
R-PBCC-N3
R-PBCC-N3
JESD-609 Code
e3
e3
Moisture Sensitivity Level
1
1
Number of Elements
1
1
Number of Terminals
3
3
Operating Temperature-Max
150 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER
Peak Reflow Temperature (Cel)
260
260
Polarity/Channel Type
NPN
NPN
Power Dissipation-Max (Abs)
0.25 W
Qualification Status
Not Qualified
Surface Mount
YES
YES
Terminal Finish
TIN
TIN
Terminal Form
NO LEAD
NO LEAD
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Transistor Application
SWITCHING
SWITCHING
Transistor Element Material
SILICON
SILICON
Base Number Matches
2
2
Date Of Intro
2017-02-01
Reference Standard
AEC-Q101; IEC-60134
Transition Frequency-Nom (fT)
230 MHz
Compare PDTC123EM,315 with alternatives
Compare PDTC123YMB with alternatives