PDS1-S3-S5-D
vs
RO-3.33.3S/P
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
CUI INC
|
RECOM POWER GMBH
|
| Package Description |
DIP-7/4
|
SIP-4
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Samacsys Manufacturer |
CUI Inc.
|
RECOM Power
|
| Analog IC - Other Type |
DC-DC UNREGULATED POWER SUPPLY MODULE
|
DC-DC UNREGULATED POWER SUPPLY MODULE
|
| Input Voltage-Max |
3.63 V
|
3.63 V
|
| Input Voltage-Min |
2.97 V
|
2.97 V
|
| Input Voltage-Nom |
3.3 V
|
3.3 V
|
| JESD-30 Code |
R-PDMA-T4
|
R-XSMA-P4
|
| Length |
12.7 mm
|
11.5 mm
|
| Number of Functions |
1
|
1
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
4
|
4
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Current-Max |
0.2 A
|
0.303 A
|
| Output Voltage-Nom |
5 V
|
3.3 V
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
DIP
|
|
| Package Equivalence Code |
DIP4/8,.3
|
SIP4,.18
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
8.45 mm
|
10.25 mm
|
| Surface Mount |
NO
|
NO
|
| Technology |
HYBRID
|
HYBRID
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
PIN/PEG
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
SINGLE
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Total Power Output-Max |
1 W
|
1 W
|
| Trim/Adjustable Output |
NO
|
NO
|
| Width |
10.16 mm
|
6 mm
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
MODULE
|
| Pin Count |
|
4
|
| Load Regulation-Max |
|
20%
|
| Output Voltage-Max |
|
3.465 V
|
| Output Voltage-Min |
|
3.135 V
|
|
|
|
Compare PDS1-S3-S5-D with alternatives
Compare RO-3.33.3S/P with alternatives