PDI1394P25BD
vs
PDI1394P25BD,157
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.31.00.01
|
| Moisture Sensitivity Level |
1
|
1
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
QFP
|
| Package Description |
|
10 X 10 X 1.40 MM, PLASTIC, LQFP-64
|
| Pin Count |
|
64
|
| Address Bus Width |
|
2
|
| Boundary Scan |
|
NO
|
| Clock Frequency-Max |
|
24.576 MHz
|
| Communication Protocol |
|
SYNC, BYTE
|
| Data Transfer Rate-Max |
|
50 MBps
|
| External Data Bus Width |
|
8
|
| JESD-30 Code |
|
S-PQFP-G64
|
| JESD-609 Code |
|
e3
|
| Length |
|
10 mm
|
| Low Power Mode |
|
YES
|
| Number of Serial I/Os |
|
1
|
| Number of Terminals |
|
64
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
LFQFP
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.6 mm
|
| Supply Voltage-Max |
|
3.6 V
|
| Supply Voltage-Min |
|
2.7 V
|
| Supply Voltage-Nom |
|
3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Finish |
|
Tin (Sn)
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.5 mm
|
| Terminal Position |
|
QUAD
|
| Width |
|
10 mm
|
| uPs/uCs/Peripheral ICs Type |
|
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
|
|
|
Compare PDI1394P25BD,157 with alternatives