PCX8245MTPU300D vs MCF5485CVR200 feature comparison

PCX8245MTPU300D Teledyne e2v

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MCF5485CVR200 Freescale Semiconductor

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Part Life Cycle Code Active Transferred
Ihs Manufacturer TELEDYNE E2V (UK) LTD FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description LBGA, 27 X 27 MM, 1 MM PITCH, MS-034AAL-1, PBGA-388
Pin Count 352 388
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 5A002
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature REQUIRES 3.3V SUPPLY
Address Bus Width 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66 MHz 66.67 MHz
External Data Bus Width 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B352 S-PBGA-B388
Length 35 mm 27 mm
Low Power Mode YES YES
Number of Terminals 352 388
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.65 mm 2.55 mm
Speed 300 MHz 200 MHz
Supply Voltage-Max 2.1 V 3.6 V
Supply Voltage-Min 1.9 V 3 V
Supply Voltage-Nom 2 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 35 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 2
Pbfree Code Yes
Rohs Code Yes
Samacsys Manufacturer NXP
JESD-609 Code e1
Moisture Sensitivity Level 3
Package Equivalence Code BGA388,26X26,40
Peak Reflow Temperature (Cel) 260
Terminal Finish TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s) 40

Compare PCX8245MTPU300D with alternatives

Compare MCF5485CVR200 with alternatives