PCX8240VTPU200C
vs
XPC8245LZU333B
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
ATMEL CORP
|
FREESCALE SEMICONDUCTOR INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
LBGA, BGA352,26X26,50
|
LBGA, BGA352,26X26,50
|
Pin Count |
352
|
352
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
32
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
66 MHz
|
66 MHz
|
External Data Bus Width |
32
|
32
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B352
|
S-PBGA-B352
|
JESD-609 Code |
e0
|
e0
|
Length |
35 mm
|
35 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
352
|
352
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Equivalence Code |
BGA352,26X26,50
|
BGA352,26X26,50
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.65 mm
|
1.65 mm
|
Speed |
200 MHz
|
333 MHz
|
Supply Voltage-Max |
2.625 V
|
2.1 V
|
Supply Voltage-Min |
2.375 V
|
1.9 V
|
Supply Voltage-Nom |
2.5 V
|
2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
35 mm
|
35 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
2
|
3
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
220
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare PCX8240VTPU200C with alternatives
Compare XPC8245LZU333B with alternatives