Findchips: Compare PCX755BVG350LE vs PC755BVGU350LE

PCX755BVG350LE vs PC755BVGU350LE feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Active	Transferred
Ihs Manufacturer	TELEDYNE E2V (UK) LTD	ATMEL CORP
Part Package Code	BGA	BGA
Package Description	BGA,	BGA, BGA360,19X19,50
Pin Count	360	360
Reach Compliance Code	compliant	unknown
ECCN Code	3A991.A.2	3A991.A.2
HTS Code	8542.31.00.01	8542.31.00.01
Address Bus Width	32	32
Bit Size	32	32
Boundary Scan	YES	YES
Clock Frequency-Max	100 MHz	100 MHz
External Data Bus Width	64	64
Format	FLOATING POINT	FLOATING POINT
Integrated Cache	YES	YES
JESD-30 Code	S-CBGA-B360	S-CBGA-B360
Length	25 mm	21 mm
Low Power Mode	YES	YES
Number of Terminals	360	360
Package Body Material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
Package Code	BGA	BGA
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	3.2 mm	3.2 mm
Speed	350 MHz	350 MHz
Supply Voltage-Max	2.1 V	2.1 V
Supply Voltage-Min	1.8 V	1.8 V
Supply Voltage-Nom	2 V	2 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Terminal Form	BALL	BALL
Terminal Pitch	1.27 mm	1.27 mm
Terminal Position	BOTTOM	BOTTOM
Width	25 mm	21 mm
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
Base Number Matches	1	2
Rohs Code		No
Additional Feature		ALSO REQUIRES 3.3V SUPPLY
JESD-609 Code		e0
Package Equivalence Code		BGA360,19X19,50
Terminal Finish		Tin/Lead (Sn/Pb)
	Microcontrollers and Processors » Microprocessors	Microcontrollers and Processors » Microprocessors