PCX755BMZFU400LE vs MPC755CPX400LE feature comparison

PCX755BMZFU400LE Thales Group

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MPC755CPX400LE Freescale Semiconductor

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer THOMSON-CSF SEMICONDUCTORS FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description , 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-360
Pin Count 360 360
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.A.2 3A991.A.1
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature 400 MHZ TO BE CONFIRMED ALSO REQUIRES 2.5V OR 3.3V SUPPLY
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 100 MHz 100 MHz
External Data Bus Width 64 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B360 S-PBGA-B360
Low Power Mode YES YES
Number of Terminals 360 360
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Speed 400 MHz 400 MHz
Supply Voltage-Max 2.1 V 2.1 V
Supply Voltage-Min 1.9 V 1.9 V
Supply Voltage-Nom 2 V 2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 4
Pbfree Code No
Rohs Code No
JESD-609 Code e0
Length 25 mm
Moisture Sensitivity Level 3
Package Code BGA
Package Equivalence Code BGA360,19X19,50
Peak Reflow Temperature (Cel) 245
Seated Height-Max 2.77 mm
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 25 mm

Compare PCX755BMZFU400LE with alternatives

Compare MPC755CPX400LE with alternatives