PCX7457VGHU600NC
vs
PCX7457MG600NC
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
TELEDYNE E2V (UK) LTD
|
| Package Description |
29 X 29 MM, 3.22 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-483
|
BGA,
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
ALSO REQUIRES 1.8V OR 2.5V SUPPLY
|
ALSO OPERATES AT 1.3V SUPPLY
|
| Address Bus Width |
36
|
36
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
167 MHz
|
167 MHz
|
| External Data Bus Width |
64
|
64
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-CBGA-B483
|
S-CBGA-B483
|
| Length |
29 mm
|
29 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
483
|
483
|
| Operating Temperature-Max |
100 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
BGA
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.2 mm
|
3.2 mm
|
| Speed |
600 MHz
|
600 MHz
|
| Supply Voltage-Max |
1.15 V
|
1.15 V
|
| Supply Voltage-Min |
1.05 V
|
1.05 V
|
| Supply Voltage-Nom |
1.1 V
|
1.1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
29 mm
|
29 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
2
|
2
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
483
|
| Temperature Grade |
|
MILITARY
|
|
|
|
Compare PCX7457VGHU600NC with alternatives
Compare PCX7457MG600NC with alternatives