PCI9050-1
vs
S5935TFC
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
PLX TECHNOLOGY INC
|
APPLIED MICRO CIRCUITS CORP
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
QFP, QFP160,1.2SQ
|
LFQFP, QFP208,1.2SQ,20
|
| Pin Count |
160
|
208
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
25
|
32
|
| Bus Compatibility |
PCI; ISA
|
I960
|
| Clock Frequency-Max |
40 MHz
|
33 MHz
|
| Data Transfer Rate-Max |
132 MBps
|
132 MBps
|
| External Data Bus Width |
32
|
32
|
| JESD-30 Code |
S-PQFP-G160
|
S-PQFP-G208
|
| JESD-609 Code |
e0
|
|
| Length |
28 mm
|
28 mm
|
| Moisture Sensitivity Level |
3
|
1
|
| Number of Terminals |
160
|
208
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
LFQFP
|
| Package Equivalence Code |
QFP160,1.2SQ
|
QFP208,1.2SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4 mm
|
1.6 mm
|
| Supply Current-Max |
130 mA
|
|
| Supply Voltage-Max |
5.25 V
|
5.25 V
|
| Supply Voltage-Min |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
28 mm
|
28 mm
|
| uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, PCI
|
BUS CONTROLLER, PCI
|
| Base Number Matches |
1
|
1
|
| Drive Interface Standard |
|
IEEE 1394
|
|
|
|
Compare PCI9050-1 with alternatives
Compare S5935TFC with alternatives