PCF8574TS/F3,518
vs
MCP23008-E/SO
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
SSOP2
|
SOIC
|
| Package Description |
LSSOP,
|
SOIC-18
|
| Pin Count |
20
|
18
|
| Manufacturer Package Code |
SOT266-1
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| Clock Frequency-Max |
0.1 MHz
|
10 MHz
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G18
|
| JESD-609 Code |
e4
|
e3
|
| Length |
6.5 mm
|
11.55 mm
|
| Number of I/O Lines |
8
|
8
|
| Number of Ports |
1
|
8
|
| Number of Terminals |
20
|
18
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LSSOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
| Seated Height-Max |
1.5 mm
|
2.65 mm
|
| Supply Voltage-Max |
6 V
|
5.5 V
|
| Supply Voltage-Min |
2.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
Matte Tin (Sn)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
4.4 mm
|
7.5 mm
|
| uPs/uCs/Peripheral ICs Type |
PARALLEL IO PORT, GENERAL PURPOSE
|
PARALLEL IO PORT, GENERAL PURPOSE
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Factory Lead Time |
|
5 Weeks
|
| Samacsys Manufacturer |
|
Microchip
|
| Moisture Sensitivity Level |
|
2
|
| Number of Bits |
|
8
|
| Package Equivalence Code |
|
SOP18,.4
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Supply Current-Max |
|
1 mA
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
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